Txais tos rau peb lub vev xaib!

Saib ze dua ntawm nyias zaj duab xis deposition technology

Nyias zaj duab xis txuas ntxiv mus nyiam cov neeg tshawb fawb.Tsab ntawv xov xwm no nthuav tawm cov kev tshawb fawb tam sim no thiab ntau qhov tob ntawm lawv cov ntawv thov, kev hloov pauv hloov pauv, thiab kev siv yav tom ntej.
"Film" yog ib lo lus txheeb ze rau ob-seem (2D) cov khoom uas yog thinner dua nws cov substrate, txawm tias nws yog npaj los npog lub substrate los yog sandwiched ntawm ob qhov chaw.Hauv cov ntawv thov kev lag luam tam sim no, cov tuab ntawm cov yeeb yaj kiab nyias no feem ntau yog los ntawm sub-nanometer (nm) atomic qhov ntev (ie, <1 nm) mus rau ntau micrometers (μm).Ib txheej graphene muaj ib lub thickness ntawm ib tug carbon atom (ie ~ 0.335 nm).
Cov yeeb yaj kiab tau siv rau kev kho kom zoo nkauj thiab cov duab kos duab hauv lub sijhawm prehistoric.Niaj hnub no, cov khoom kim heev thiab cov hniav nyiaj hniav kub yog coated nrog nyias zaj duab xis ntawm cov hlau zoo xws li tooj liab, nyiaj, kub thiab platinum.
Kev siv ntau tshaj plaws ntawm cov yeeb yaj kiab yog kev tiv thaiv lub cev ntawm qhov chaw los ntawm kev puas tsuaj, cuam tshuam, khawb, yaig thiab puas.Pob zeb diamond zoo li carbon (DLC) thiab MoSi2 cov khaubncaws sab nraud povtseg yog siv los tiv thaiv lub tsheb cav los ntawm kev hnav thiab kub kub corrosion tshwm sim los ntawm kev sib txhuam ntawm cov khoom txav mus los.
Cov yeeb yaj kiab nyias kuj tseem siv los tiv thaiv qhov chaw reactive los ntawm ib puag ncig, txawm tias nws yog oxidation lossis hydration vim ya raws.Shielding conductive films tau txais kev saib xyuas ntau hauv cov khoom siv semiconductor, dielectric film separators, nyias zaj duab xis electrodes, thiab electromagnetic cuam tshuam (EMI).Tshwj xeeb, hlau oxide teb cov nyhuv transistors (MOSFETs) muaj cov tshuaj lom neeg thiab thermally ruaj khov dielectric zaj duab xis xws li SiO2, thiab ntxiv hlau oxide semiconductors (CMOS) muaj cov yeeb yaj kiab tooj liab.
Nyias-film electrodes nce qhov sib piv ntawm lub zog ceev rau lub ntim ntawm supercapacitors los ntawm ob peb zaug.Tsis tas li ntawd, cov yeeb yaj kiab hlau nyias thiab tam sim no MXenes (hloov hlau carbides, nitrides lossis carbonitrides) perovskite ceramic nyias zaj duab xis yog dav siv los thaiv cov khoom siv hluav taws xob los ntawm electromagnetic cuam tshuam.
Hauv PVD, cov khoom siv yog vaporized thiab xa mus rau lub tshuab nqus tsev uas muaj cov substrate.Vapors pib tso rau ntawm qhov chaw ntawm lub substrate tsuas yog vim yog condensation.Lub tshuab nqus tsev tiv thaiv kev sib xyaw ntawm impurities thiab kev sib tsoo ntawm vapor molecules thiab cov roj seem seem.
Lub turbulence nkag mus rau hauv lub chav, qhov kub thiab txias gradient, chav dej ntws, thiab latent cua sov ntawm lub hom phiaj cov ntaub ntawv ua lub luag haujlwm tseem ceeb hauv kev txiav txim siab txog zaj duab xis uniformity thiab lub sijhawm ua.Cov txheej txheem evaporation muaj xws li cua sov tiv taus, hluav taws xob hluav taws xob hluav taws xob thiab, tsis ntev los no, molecular beam epitaxy.
Qhov tsis zoo ntawm cov pa PVD yog nws tsis muaj peev xwm ua rau vaporize siab heev melting point cov ntaub ntawv thiab cov qauv kev hloov induced nyob rau hauv cov khoom deposited vim lub evaporation-condensation txheej txheem.Magnetron sputtering yog cov txheej txheem tom ntej lub cev tso tawm uas daws cov teeb meem no.Nyob rau hauv magnetron sputtering, lub hom phiaj molecules yog ejected (sputtered) los ntawm bombardment nrog lub zog zoo ions los ntawm ib tug sib nqus teb generated los ntawm ib tug magnetron.
Cov yeeb yaj kiab nyias nyob hauv ib qho chaw tshwj xeeb hauv cov khoom siv hluav taws xob niaj hnub no, kho qhov muag, kho qhov muag, photonic, thermal thiab magnetic li thiab txawm tias cov khoom siv kho kom zoo nkauj vim lawv ntau yam, compactness thiab ua haujlwm zoo.PVD thiab CVD yog cov feem ntau siv vapor deposition txoj kev los tsim nyias films xws li thickness ntawm ob peb nanometers mus rau ob peb micrometers.
Qhov kawg morphology ntawm cov zaj duab xis deposited cuam tshuam nws kev ua tau zoo thiab efficiency.Txawm li cas los xij, nyias zaj duab xis Evaporative tso tawm cov lus qhia ntxaws ntxiv raws li cov txheej txheem sau ua ke, xaiv cov khoom lag luam, thiab substrate cov khoom.
Kev lag luam thoob ntiaj teb semiconductor tau nkag mus rau lub sijhawm zoo siab.Kev thov rau cov tshuab chip muaj ob qho tib si spurred thiab retarded txoj kev loj hlob ntawm kev lag luam, thiab tam sim no chip tsis txaus yuav tsum tau mus ntxiv rau qee lub sij hawm.Cov qauv tam sim no yuav ua rau lub neej yav tom ntej ntawm kev lag luam raws li qhov no txuas ntxiv mus
Qhov sib txawv tseem ceeb ntawm graphene-raws li roj teeb thiab cov roj teeb hauv lub xeev yog cov muaj pes tsawg leeg ntawm cov electrodes.Txawm hais tias cathodes feem ntau hloov kho, allotropes ntawm carbon kuj tuaj yeem siv los ua anodes.
Nyob rau hauv xyoo tas los no, Is Taws Nem ntawm Yam tau ua tiav sai hauv yuav luag txhua qhov chaw, tab sis nws tseem ceeb tshwj xeeb hauv kev lag luam tsheb hluav taws xob.


Post lub sij hawm: Apr-23-2023